Collaborating Components in Mesh-Based Electronic Packaging

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Multi-layered stacks are commonly used in microelectronic packaging. Traditionally, these systems are designed using linear-elastic analysis either with analytical solutions or finite element method. Linear-elastic analysis for layered structures yields very conservative results due to stress singularity at the free edge. In this paper, it is shown that a damage mechanics based nonlinear analys...

Collaborating over Electronic Books

In this position paper we argue that electronic book and document readers (H UHDGHUV) open new avenues for computer supported collaborative work. This position draws on our experience building and e-reading with the XLibris “active reading machine,” a portable pen-based computer specialized for the task of reading, critical thinking, and analysis.

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...

Opto - Electronic Packaging

Cost-Efficient Deployment of Collaborating Components

We study the problem of efficient deployment of software components in a service engineering context. Run-time manipulation, adaptation and composition of entities forming a distributed service is a multi-faceted problem challenged by a number of requirements. The methodology applied and presented can be viewed as an intersection between systems development and novel network management solution...